Horizontal hydrogen annealing device (variable atmosphere heat treatment device)
Supports small-diameter wafers (4 inches) and niche processes for compound semiconductors. Compatible with both crystal processes and wafer processes (alloying and electrode annealing).
A dedicated annealing device designed for special applications such as epitaxial layers of compound semiconductors and the annealing of polished Si wafers. After high vacuum evacuation, the atmosphere is replaced with hydrogen up to atmospheric pressure, allowing for uniform heating at high temperatures (1000°C) in a high-purity reducing atmosphere.
- Company：神港精機 東京支店
- Price：Other
